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General Facilities

Welcome to the general facilities page.

We list here the facilities present at the centre used and run by the platforms.




First Floor@SHR

8 - Electrochemical characterization of materials and devices (ELCHEMLab)











Second Floor@SHR

9 - CAD Labs

10 - Electronics Lab

11 - Robotics Lab (R-Lab)

12 - Photovoltaic Lab (PVLab)

13 - SENsing Skin characterization (SENSLab)

14 - Artificial Physiology (APLab)

15 - Electrical Characterization Lab (ECLab)


Thin Film Lab

This lab is devoted to the development of functional materials in the form of thin films. It is equipped with a confocal co-sputter system (KS 300 CONFOCAL Dual, Kenosistec) for the deposition of metals, oxides, and nitrides. It is also labeled as a “cluster” system, since it is composed by two distinct deposition chambers, one for metals and nitrides, the other for oxides. These are connected to each other by a central load-lock chamber. Each deposition chamber is equipped with three magnetron water-cooled cathodes (2” and 3” in-diameter), organized in a confocal geometry. These can work simultaneously in DC or RF mode, and both their tilt angle and distance from the anode can be varied. In this cluster system, deposition of multilayer structures or co-deposition of different materials can be performed. The presence of a suitable vacuum system allows to reach pressure values up to 2×10-7 mbar within just 5 hours. The system is designed to deposit on substrates up to 6” in diameter, from room temperature up to 800°C. The rotating sample holder is connected to a DC power supply, in order to provide a DC polarization voltage to the substrates.

Developed materials:

  • Oxides:
      Highly (002) oriented Zinc Oxide thin films
      Zinc Oxide thin films doped with different chemical elements (Li, V, Ga, co-doped Ga:Li)
  • Metals:
      Bilayer structures (Ta/Au, Ta/Pt)


Piezoelectric/Ferroelectric thin films for MEMS devices

Metal electrodes for memristive devices


Pattern Generator Laserwriter LW405

The laser writer system LW405, provided by Microtech srl, is a laser pattern generator for patterning planar structures on a mask or on the final substrate, through the exposure of a photoresist. This system is used in a typical R&D environment, where there is the need for prototype fabrication or production of masks for optical photolithography. The write unit of the LW405 allocates a GaN laser, with a wavelength of 405nm, the substrate microtranslation system and a laser interfometer (needed for the precise control of the position of the substrate during the “writing” process). Wafers up to 6”diameter and photolithographic masks up to 4” can be processed with this system. This system is particularly useful for the fabrication of 4” x 4” masks for photolithography, constituted by a soda-lime glass plate coated with Low Reflective Chrome (100nm thick) and with AZ1518 photoresist. This equipment is located in a ISO5 cleanroom at the Chilab-Materials and Microsystems Laboratory of the Politecnico di Torino.

Rapid thermal annealer Solaris RTP 100

This system is a rapid thermal annealing equipment able to process substrates up to 4” diameter. The Solaris RTP 100 has a recipe management and system diagnostics interfaces especially useful for a R&D environments. The annealing tests can be performed both in inert atmosphere (Nitrogen), or in a Nitrogen/Oxygen atmosphere. The substrates can be heated up to 1200°C with ramp rates up to 150°C/s. At all temperatures the systems is able to achieve a temperature uniformity of +/- 2.5°C across a 4”wafer. The SOLARIS RTP 100 is particular useful for the annealing of thin layer of Tantalum, Molybdenum,Tantalum/Platinum deposited on Silicon, Silicon/Silicon dioxyde and Silicon/Silicon nitride substrates, with the aim to prepare metal electrodes needed for the fabrication of Organic Field Emission Transistors (OFETs) The thermal oxidation of Molybdenum and Tantalum thin films was also performed, in order to obtain gate oxides for OFETs. This equipment is located in a ISO7 clean room at the Chilab-Materials and Microsystems Laboratory of the Politecnico di Torino.

tflab 1


Multiprocessor cluster tool for simulation

Transmission Electron Microscopy Lab

This lab is devoted to the structural characterization of materials at the nanometer scale, performed with a versatile Transmission Electron Microscope, a FEI Tecnai G2 F20 S-TWIN, 200KV. With this tool it is possible for example to investigate the crystalline structure of the materials by HR-TEM and electron diffraction, to map the composition by EDS and EELS, to reconstruct a 3D image of the sample by tomography.

TEMlab 1


Techniques available

TEM, HR-TEM, STEM, Diffraction, EFTEM, EDS and EELS Spectrum Imaging, Tomography.

Essential specifications

Point resolution (nm) 0.24

Information limit (nm) ≤ 0.15

HR STEM resolution (nm) 0.2

Cs objective (mm) 1.2

Cc objective (mm) 1.2

Focal length (mm) 1.7

Maximum eucentric tilt ± 40°

Electron source

- Schottky Field emitter with high maximum beam current (> 100 nA)

- High probe current (> 0.6 nA in a 1 nm spot)

- Small energy spread (0.7 eV@200kV or less)

- Spot drift < 1 nm/minute - High short and long term stability


- Bright Field and Annular Dark Field mode

- High sensitivity HAADF STEM detector

- Magnification range 200 x - 100 Mx

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Additive Manufacturing for Metals Lab

The Additive Manufacturing is equipped with a Direct Metal Laser Sintering Machine, EOSINT M270 Xtended, and a sand-blasting machine, SD9 Northblast

In this lab the goal is to realize the fundamental structural parts of the finger exoskeleton in different materials: lightweight aluminium alloys, high strength titanium alloys, new composites and smart materials developed for Additive Manufacturing.

Facilities in detail

EOSINT M 270 Xtended

This machine fuses metal powder into a solid part by melting it locally using a focused laser beam. The parts are built up additively layer by layer. Even complex geometries are created directly from 3D CAD data, fully automatically, in just a few hours and without any tooling. It is a net-shape process, producing parts with good surface quality and mechanical properties.

Wide variety of materials can be processed by this machine, ranging from light alloys via steels to superalloys.

- Effective building volume: 250x250x215 mm.
- Building speed: 2-20 mm3/s.
- Layer thickness: 20-100 μm.
- Laser type: Yb-fibre laser, 200W.
- Precision optics: F-theta lens, high speed scanner.
- Scan speed: up to 7 m/s.
- Variable focus diameter: 100-500 μm.

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Sand-blasting machine, SD9 Norblast

This machine allows enhancing quickly the finishing aspect and the mechanical properties of the surface metal components realized by the DMLS machine.
SD9 Norblast is small-size manual machine, integrated with dust suction and filtration system. Compact SD9 unit is small-size manual machine, integrated with dust suction and filtration system. The “compact” units are equipped with vacuum blasting system, which is user-friendly and simple to install. They do not need too much room for installation thanks to their tidy and compact layout.










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