This lab is devoted to the development of functional materials in the form of thin films. It is equipped with a confocal co-sputter system (KS 300 CONFOCAL Dual, Kenosistec) for the deposition of metals, oxides, and nitrides. It is also labeled as a “cluster” system, since it is composed by two distinct deposition chambers, one for metals and nitrides, the other for oxides. These are connected to each other by a central load-lock chamber. Each deposition chamber is equipped with three magnetron water-cooled cathodes (2” and 3” in-diameter), organized in a confocal geometry. These can work simultaneously in DC or RF mode, and both their tilt angle and distance from the anode can be varied. In this cluster system, deposition of multilayer structures or co-deposition of different materials can be performed. The presence of a suitable vacuum system allows to reach pressure values up to 2×10-7 mbar within just 5 hours. The system is designed to deposit on substrates up to 6” in diameter, from room temperature up to 800°C. The rotating sample holder is connected to a DC power supply, in order to provide a DC polarization voltage to the substrates.
- Highly (002) oriented Zinc Oxide thin films
- Zinc Oxide thin films doped with different chemical elements (Li, V, Ga, co-doped Ga:Li)
- Bilayer structures (Ta/Au, Ta/Pt)
Piezoelectric/Ferroelectric thin films for MEMS devices
Metal electrodes for memristive devices
Pattern Generator Laserwriter LW405
The laser writer system LW405, provided by Microtech srl, is a laser pattern generator for patterning planar structures on a mask or on the final substrate, through the exposure of a photoresist. This system is used in a typical R&D environment, where there is the need for prototype fabrication or production of masks for optical photolithography. The write unit of the LW405 allocates a GaN laser, with a wavelength of 405nm, the substrate microtranslation system and a laser interfometer (needed for the precise control of the position of the substrate during the “writing” process). Wafers up to 6”diameter and photolithographic masks up to 4” can be processed with this system. This system is particularly useful for the fabrication of 4” x 4” masks for photolithography, constituted by a soda-lime glass plate coated with Low Reflective Chrome (100nm thick) and with AZ1518 photoresist. This equipment is located in a ISO5 cleanroom at the Chilab-Materials and Microsystems Laboratory of the Politecnico di Torino.
Rapid thermal annealer Solaris RTP 100
This system is a rapid thermal annealing equipment able to process substrates up to 4” diameter. The Solaris RTP 100 has a recipe management and system diagnostics interfaces especially useful for a R&D environments. The annealing tests can be performed both in inert atmosphere (Nitrogen), or in a Nitrogen/Oxygen atmosphere. The substrates can be heated up to 1200°C with ramp rates up to 150°C/s. At all temperatures the systems is able to achieve a temperature uniformity of +/- 2.5°C across a 4”wafer. The SOLARIS RTP 100 is particular useful for the annealing of thin layer of Tantalum, Molybdenum,Tantalum/Platinum deposited on Silicon, Silicon/Silicon dioxyde and Silicon/Silicon nitride substrates, with the aim to prepare metal electrodes needed for the fabrication of Organic Field Emission Transistors (OFETs) The thermal oxidation of Molybdenum and Tantalum thin films was also performed, in order to obtain gate oxides for OFETs. This equipment is located in a ISO7 clean room at the Chilab-Materials and Microsystems Laboratory of the Politecnico di Torino.